According to the latest report by IMARC Group, "Global Advanced IC Substrate Market Size, Share, Growth, Industry Trends, Opportunity and Forecast 2023-2028", the global advanced IC substrate market size reached US$ 9.4 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 13.8 Billion by 2028, exhibiting a growth rate (CAGR) of 6.2% during 2023-2028.
An advanced integrated circuit (IC) substrate is a baseboard that links the printed circuit boards (PCBs) to the semiconductor chips. It is compact, durable, lightweight, cost-effective, and delivers superior electrical properties. It also reduces the overall weight of PCBs and enhances their functionality and dimensional control. As a result, advanced IC substrates are widely employed in various electronic products such as personal computers, mobiles, microwaves, and ovens.
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Advanced IC Substrate Market Trends and Drivers:
The increasing demand for miniaturized consumer electronic products, such as tablets, laptops, smartphones, and personal computers (PCs), is primarily driving the market growth. In addition, the surging need for remote-controlled electrical equipment in industrial applications represents another major growth-inducing factor. Besides this, defense agencies are widely deploying advanced IC substrates in sensitive microelectronics to safeguard them against radiation and other hazardous conditions.
This, coupled with the rising popularity of cars with driverless and advanced safety features and infotainment techniques, is contributing to the adoption of IC substrates in the automotive industry. On account of these factors, the market is expected to witness a positive growth in the coming years.
Global Advanced IC Substrate Market 2023-2028 Analysis and Segmentation:
Competitive Landscape:
The competitive landscape of the market has been studied in the report with the detailed profiles of the key players operating in the market.
Advanced IC Substrate Companies:
Fujitsu Limited, Ibiden Co. Ltd., JCET Group Co. Ltd, Kinsus Interconnect Technology Corp., Korea Circuit Co. Ltd., ASE Group, AT S Austria Technologie Systemtechnik Aktiengesellschaft, KYOCERA Corporation, LG Innotek Co. Ltd., Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation), TTM Technologies Inc. and Unimicron Technology Corporation (United Microelectronics Corporation).
The report has segmented the market on the basis of type, application and region.
Breakup by Type:
- FC BGA
- FC CSP
Breakup by Application:
- Consumer Electronics
- Automotive and Transportation
- IT and Telecom
- Others
Breakup by Region:
- North America: (United States, Canada)
- Asia Pacific: (China, Japan, India, South Korea, Australia, Indonesia, Others)
- Europe: (Germany, France, United Kingdom, Italy, Spain, Russia, Others)
- Latin America: (Brazil, Mexico, Others)
- Middle East and Africa
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Key highlights of the report:
- Market Performance (2017-2022)
- Market Outlook (2023-2028)
- Porter’s Five Forces Analysis
- Market Drivers and Success Factors
- SWOT Analysis
- Value Chain
- Comprehensive Mapping of the Competitive Landscape
If you need specific information that is not currently within the scope of the report, we can provide it to you as a part of the customization.
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